| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation mechanism that does not hamper low-profile electronic equipment having a PCB while preventing thermal destruction, thermal deterioration, and malfunctions of a heat evolving element and other electronic components as well as thermal deformation of an enclosure housing them and moderate-temperature burn, and electronic equipment having the same. <P>SOLUTION: The heat dissipation mechanism is composed of a through-hole provided in a mother board and a cooling fan and protects various circuit components mounted on the mother board from heat. <P>COPYRIGHT: (C)2004,JPO</p> |
