| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which the section of a sample is inspected in a process for manufacturing a semiconductor, the sample is returned to a manufacturing line, and the manufacturing is continued without exerting an influence on the manufacturing of the sample and the manufacturing line. SOLUTION: The method comprises a process for carrying out local machining in order to make the section of a semiconductor wafer exposed after an arbitrary process in the manufacturing of the semiconductor wafer; a process for inspecting the section; a process for analyzing the defect of the semiconductor wafer based on information about the section inspection, information about a manufacturing history in the arbitrary process and its preceding processes, information about the inspection of foreign matter, patterns, etc, in the arbitrary process and its preceding processes, and information of a design when the previous inspection determines that the section is defective, and correcting manufacturing conditions in the arbitrary process and its preceding processes based on the result of the defect analysis; and a process for filling a part removed to make the section of the semiconductor wafer exposed. The semiconductor wafer is returned to a process subsequent to the the arbitrary process and the manufacturing is continued. COPYRIGHT: (C)2004,JPO
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