| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of preventing oxidation on a wafer surface after a polishing process and preventing the occurrence of a photoelectromotive force in a pn junction beneath the wafer surface to prevent the adsorption of different kinds of molecules or particles. SOLUTION: A wafer polishing device 10 is provided with an organic film coating module 94 for coating an organic film on a wafer W, and a light blocking organic film is used for the organic film coating the wafer W. Further, the polishing device comprises a storage chamber for intercepting wafers from outside air and an inert gas supply means 69 for filling an inert gas in the storage chamber. COPYRIGHT: (C)2004,JPO
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