| 摘要 |
PROBLEM TO BE SOLVED: To simply form a backing in which a lead array is embedded, and to reduce an electric stroke. SOLUTION: A plurality of X-grooves are formed to an absorbing material and filled with conductive materials. Thereafter, a plurality of Y-grooves are formed to be filled with the absorbing material. By this constitution, the backing 108 having the lead array built therein is constituted. A matrix shield surrounding respective leads may be further built in the backing 108. COPYRIGHT: (C)2004,JPO
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