| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS FABRICATING METHOD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem, in semiconductor filip mounting, that if distribution of a filler in a sealing resin varies asymmetrically within a semiconductor plane, when a thermal hysteresis is applied, a semiconductor device is not deformed to exert a harmful effect to its reliability. <P>SOLUTION: A portion 9 with low density of the filler in the sealing resin is made to radiate from the center of the semiconductor element to be thereby distributed symmetrically within the semiconductor device plane. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2004039886(A) |
申请公布日期 |
2004.02.05 |
| 申请号 |
JP20020195484 |
申请日期 |
2002.07.04 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KOJIMA TOSHIYUKI;TOMURA YOSHIHIRO;SHIRAISHI TSUKASA;TOMEKAWA SATORU;KUMANO YUTAKA;SAITO RYUICHI;MITSUDA AKIFUMI |
| 分类号 |
H01L21/60;H01L21/56;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
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