Process and device for feed control of a wire saw for hard materials such as silicon wafers monitors the wire bending throughout the cut

摘要

A process for sawing hard material (5) with a wire saw (8) comprises determining (1) the bending (11) of the wire and controlling the saw feed depending on the chosen bending, which is maintained through the whole sawing process. An Independent claim is also included for a sawing device for the above process.