| 摘要 |
PROBLEM TO BE SOLVED: To restrain molding failures such as shrinkage voids or unfilled parts from occurring behind the rear surface of a housing. SOLUTION: A lead-inserted semiconductor device is equipped with a first lead, a semiconductor chip mounted on the first lead, a second lead which is arranged at a level different from that of the first lead as separating from it, a bonding wire connecting the first lead and second lead together, and the housing 17 sealing the semiconductor chip and a mount where the chip is mounted with resin. In the method of manufacturing the semiconductor device, a resin pouring gate 20 for forming the housing 17 is arranged on the predetermined side of the housing in parallel with the lengthwise direction of the second leads 15 and 16 and near the first lead, and then a resin pouring process is carried out. COPYRIGHT: (C)2004,JPO
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