| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method capable of reducing particles that stick to wafer surfaces. SOLUTION: In this wet processing method wherein semiconductor wafers W are immersed in a process liquid, the semiconductor wafers W are immersed with their surfaces W1 facing upward, with the wafers W inclined at 3-45°or 10-20°relative to the process liquid surface H. COPYRIGHT: (C)2004,JPO
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