| 发明名称 |
Method of mounting integrated circuit die in a package using a solder preform having isolatable portions |
| 摘要 |
A method of mounting an integrated circuit die on an inside surface of a cover for an IC package uses a solder preform having isolatable structures that provide connections to a plurality of metalized pads while allowing selective electrical isolation therebetween.
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| 申请公布号 |
US2004021219(A1) |
申请公布日期 |
2004.02.05 |
| 申请号 |
US20020210445 |
申请日期 |
2002.08.01 |
| 申请人 |
STUDEBAKER JAMES |
发明人 |
STUDEBAKER JAMES |
| 分类号 |
H01L23/10;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/10 |
| 代理机构 |
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