发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of stabilizing an electrical resistance between a capacitor and dopant diffusion region of a transistor low and decreasing the number of processes. <P>SOLUTION: A gate electrode having gate structures 16a, 16b and sidewall spacers 22a on a silicon wafer 10 in a DRAM forming region and a logic forming region. Contact holes to an upper surface of the wafer 10 in the DRAM forming region are formed in a first interlayer insulation film 30 deposited on the gate electrode. These contact holes are opened so that they overlap the sidewall spacers 22a, a part of the gate electrode. A capacitor comprising a lower electrode 40, a high dielectric film 41, and an upper electrode 42 is formed along an inner wall of these contact holes. This significantly decreases a variation in contact area between the lower electrode 40 and a silicide film 23a on the surface of the impurity diffusion region 21a to stabilize electrical resistance between the both low. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004039714(A) 申请公布日期 2004.02.05
申请号 JP20020191754 申请日期 2002.07.01
申请人 RENESAS TECHNOLOGY CORP 发明人 SOGO YASUNORI;YOSHIMUNE HIROYASU
分类号 H01L21/768;H01L21/8238;H01L21/8242;H01L27/092;H01L27/10;H01L27/108 主分类号 H01L21/768
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