| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board where a conductor layer between insulating layers contains a conductor wiring layer and a plane conductor layer capable of improving the flatness of the surface of a resin insulating layer on the conductor layer and a method for manufacturing the wiring board. SOLUTION: This wiring board 101 is provided with a main face side first insulating layer 113, a main face side second insulating layer 114 laminated over this, and a main face side second conductor layer 127 formed between those layers, including a conductor wiring layer 128 and a plate-shaped plane conductor layer 129. The plane conductor layer 129 is shaped like a mesh where a plurality of holes 129K are formed, and the surface of the second resin insulating layer 114 is provided with flatness whose difference in elevation is 8μm or less. COPYRIGHT: (C)2004,JPO |
