| 摘要 |
PROBLEM TO BE SOLVED: To increase the durability of a runner section of a metal mold and to form a package into a satin finish surface. SOLUTION: A lead terminal type semiconductor element comprises a first lead 24, semiconductor chip 25 mounted on the first lead 24, second lead disposed away from the first lead 24, connector 28 for connecting the first lead 25 and the second lead, and package 22 for resin-sealing the semiconductor chip 25 and at least part of the first lead where the chip 25 is mounted. A plurality of such lead terminal type semiconductor elements are connected via through gates 30 to form a lead terminal type semiconductor device. The packages 22 of the lead terminal type semiconductor elements 21 are connected to each other via the through gates 30, with each through gate 30 being floated from a bottom surface of the package of each lead terminal type semiconductor element 21. COPYRIGHT: (C)2004,JPO
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