发明名称 |
TIN-SILVER-COPPER PLATING SOLUTION, PLATING FILM CONTAINING THE SAME, AND METHOD FOR FORMING THE PLATING FILM |
摘要 |
A tin-silver-copper containing plating solution which comprises a medium having water as its primary component, a sulfonic acid, a tin ion, a copper ion and a silver ion, wherein concentrations of the silver ion, the tin ion and the copper ion are 0.015 to 0.1 mol/L, 0.21 to 2 mol/L and 0.002 to 0.02 mol/L, respectively; a plating film which comprises 2.6 to 3.4 wt % of silver, 0.4 to 0.7 wt % of Cu and the substantially balanced amount of tin; an electrolytic plating method for use in forming the above plating film from the above plating solution; and a soldering method using the plating film. The plating solution exhibits high stability, and the plating film has a low melting point. |
申请公布号 |
WO2004011698(A1) |
申请公布日期 |
2004.02.05 |
申请号 |
WO2003JP09351 |
申请日期 |
2003.07.23 |
申请人 |
SHINRYO ELECTRONICS CO., LTD.;SONODA, HIROMI;NAKAMURA, KATSUJI |
发明人 |
SONODA, HIROMI;NAKAMURA, KATSUJI |
分类号 |
C25D3/60;C25D5/18;C25D17/02;C25D17/10;H05K3/34 |
主分类号 |
C25D3/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|