| 摘要 |
The present invention provides a method and apparatus for using light emitti ng diodes for curing in various applications. The method includes a novel metho d for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention th at utilizes heat pipes performs far more efficiently in much more compact space . This allows much more closely spaced LEDs operating at higher power and brightness. |
