CHIP SCALE PACKAGE OF MEMS DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A chip scale package of an MEMS(Micro-Electro-Mechanical-System) device and a manufacturing method thereof are provided to be capable of easily carrying out a mounting process at the minimum surface area of an outer circuit board. CONSTITUTION: A chip scale package of an MEMS device is provided with a lower substrate(500) having a plurality of via holes, an upper substrate(400), a plurality of conductive material parts(540) formed at the via holes, and a plurality of MEMS devices(550) loaded at the predetermined portions of the lower substrate. The chip scale package further includes a connection part for electrically connecting the conductive material part with the MEMS device and an adhesive part(430) for attaching the upper substrate to the lower substrate.