| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for inspecting an FBGA substrate and a semiconductor device capable of inspecting defective bondings at the same time of bonding, and to provide a method for manufacturing the semiconductor device capable of improving the efficiency of an assembling process by removing contained defective products. <P>SOLUTION: By the use of an FBGA substrate 14 comprising a substrate 1, a wiring layer 2 on which a pattern including a bonding pad 6 connected to a semiconductor element 4 and plated lead wire 12 connected to the pad 6 is formed, an insulation layer 3 formed on the wiring layer and has a pattern in which at least a part of the pad 6 and the wire 12 is exposed formed on it, the defective connection of wire bonding after mounting the semiconductor element 4 is inspected and a semiconductor device of which the connection is confirmed is manufactured through a post-process. <P>COPYRIGHT: (C)2004,JPO |
