发明名称 FLAT-PLATE-TYPE HEAT PIPE AND COOLING DEVICE OF ELECTRONIC ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a flat-plate-type heat pipe assuring good manufacturability and easy layout. SOLUTION: The flat-plate-type heat pipe 2 is structured so that a working fluid of condensing type to convey heat as an evaporative latent heat is encapsulated in a container 6 in a flat plate shape, and includes a container upper part 6A and a container lower part 6B joined with each other in air-tight condition for forming the container 6, wherein a through hole 6E is formed in the container lower part 6B, and the contour of the container upper part 6A has a runoff groove 11 in such a form as retreating toward the inside of the container 6 from the outside line of the container 6 in the neighbourhood of the through hole 6E and following the peripheral part of the through hole 6E, and the container upper part 6A is joined with the container lower part 6B at the contour part 6C. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004037001(A) 申请公布日期 2004.02.05
申请号 JP20020194959 申请日期 2002.07.03
申请人 FUJIKURA LTD 发明人 MOCHIZUKI MASATAKA;MASUKO KOICHI
分类号 F28D15/02;H01L23/40;H01L23/427;(IPC1-7):F28D15/02 主分类号 F28D15/02
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