发明名称 Perforated adhesive film and its manufacturing process
摘要 The invention relates to a perforated adhesive film (16) that will be used to glue a wall on one face of a cellular structure (10) to form a sandwich panel. The adhesive film (16) comprises at least one hole and not more than three holes (18) facing each of the cells (12) of the cellular structure (10). Preferably, the holes (18) are formed by punching an unperforated adhesive film. The holes (18) enable the formation of regular glue dabs on the ends of the partitions (14) separating cells (12) in the cellular structure (10), when the adhesive film (16) is heated before the wall is glued.
申请公布号 US2004023026(A1) 申请公布日期 2004.02.05
申请号 US20030421671 申请日期 2003.04.22
申请人 RAMBAUD ERIC;VITONOU DONA 发明人 RAMBAUD ERIC;VITONOU DONA
分类号 B26F1/24;B32B37/14;B32B37/16;C09J7/02;(IPC1-7):B32B7/12 主分类号 B26F1/24
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