Elektronisches Bauteil, Herstellverfahren, sowie Verfahren zum Herstellen einer elektrischen Verbindung zwischen dem Bauteil und einer Leiterplatte

摘要

An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.