| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad for chemomechanical polishing having recesses of a prescribed form on the polishing surface side to be capable of restricting generation of scratches in a subject surface. <P>SOLUTION: This polishing pad has grid type grooves on the polishing surface side, and surface roughness of inner surfaces of the grooves is 20μm or less, or especially 10μm or less. For the grooves, depth is 0.1 mm or more, or especially 0.1-2.5 mm, width is 0.1 mm or more, or especially 0.1-5 mm or more, and minimum distance between adjacent grooves is 0.05 mm or more, or especially 0.05-100 mm or more. In addition, the polishing pad comprises non-water-soluble matrix material including crosslinking polymer such as crosslinking 1, 2-polybutadiene, etc., and water-soluble grains comprising polysaccharides, etc., dispersed in the non-water-soluble matrix, more preferably. The polishing pad can be a multi-layer type polishing pad having a flexible support layer comprising resin foam material or the like on the reverse side. <P>COPYRIGHT: (C)2004,JPO |
