SURFACE TREATMENT METHOD AND MANUFACTURING EQUIPMENT FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a surface treatment method capable of reducing a manufacturing time, and manufacturing equipment for a semiconductor device.

SOLUTION: The surface treatment method is provided with an ionizing process wherein a substance is ionized and an ionizing substance is produced; a starting process for starting the introduction of the ionized ionizing substance into a base substance; a finishing process for finishing the introduction of the ionizing substance into the base substance; a measuring process wherein an ion current value of the ionizing substance ionized in the ionizing process is measured before finishing the finishing process; and a control process wherein an ion injection treatment time showing a time from the starting process until the finishing process is controlled on the basis of measurements by the measuring process in such a manner that a total dose showing the total amount of the ionizing substance which is introduced in the base substance becomes a desired total dose.

COPYRIGHT: (C)2004,JPO