| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of solving a problem of prior arts, the problem causing defective appearance to the conventional wiring board due to spotlike stain caused by heat or the like produced when electronic components are soldered to the surface of a gold plated layer on a nickel plated layer formed on the surface of a wiring layer of the wiring board made of glass ceramics by a low melting point soldering material. SOLUTION: The wiring board 4 is formed by adhering a wiring layer 2, whose major component is copper and to which electrodes of electronic components 3 are soldered by a low melting point soldering material 5, on an insulation board 1 made of glass ceramics, wherein a nickel plated layer 6 containing 0.05 to 0.3 ppm of selenium or antimony and a gold plated layer 7 are sequentially formed by electroless plating on the surface of an area of the wiring layer 2 to which the electrodes of electronic components 3 are soldered by the low melting point soldering material 5. Residual plating liquid can be avoided by suppressing occurrence of an abnormal precipitation of the nickel plated layer 6 so as to prevent occurrence of the defective appearance of the board caused by formation of the spotlike stain on the surface of the gold plated layer resulting from the residual plating liquid. COPYRIGHT: (C)2004,JPO |
