METHOD FOR PEELING ADHEREND

摘要

PROBLEM TO BE SOLVED: To provide a method for peeling an adherend from a flexible sheet substrate bonded with a temperature-sensitive adhesive in high peeling efficiency in a non-tacky preset temperature range without damaging the adherend. SOLUTION: The adherend 9 bonded to a flexible sheet substrate 7 with a temperature-sensitive adhesive 8 is peeled from the sheet substrate 7 in a non-tacky preset temperature range by using an air chamber 1 having rounded convex 11 and concave part 12 and an air-sucking hole 13, passing the sheet substrate 7 along the convex part 11 in a state sucked with the suction force applied by the air sucking hole 13 fwof the wall and passing on the concave part 12. COPYRIGHT: (C)2004,JPO