| 摘要 |
<p>A method for manufacturing a semiconductor device wherein an ultra-thin semiconductor chip having a thickness of 50 mum or less is properly picked up and mounted. A protective tape (42) for use in back grinding is adhered to a surface of a wafer (40), and back grinding, wafer mounting and dicing are conducted as it is. Accordingly, the protective tape (42) adhered to the surface of the chip improves the fracture-resistant property of the chip, thereby preventing the chip from cracking or breaking during the pick-up and chip-mounting steps. After the mounting, the protective tape (42) is removed from the surface of the chip.</p> |
