| 摘要 |
PURPOSE: An integrated circuit device and an electronic device are provided to increase a degree of integration by preventing any occurrence of an electrical connection between circuits formed in integrated circuits of upper and lower layers in a multilayer structure. CONSTITUTION: An integrated circuit device has an integrated circuit(2) formed on a front surface of a silicon substrate(1), an insulating layer(12) formed on a rear surface of the substrate, and connection piles(4) penetrating the substrate, the integrated circuit, and the insulating layer. An electronic device has plural integrated circuit devices laminated in a multilayer structure, in which a connection pile formed in an integrated circuit in the device as an upper position in the multilayer structure is electrically connected to a connection pile formed in an integrated circuit as a lower position under a requirement of an electric connection for the piles. The pile is electrically insulated from the pile through the insulating layer under no requirement of the electric connection for them. |
