Bonding pads of printed circuit board capable of holding solder balls securely

摘要

The present invention is to provide a printed circuit board, which comprises a substrate (10), a conductive pattern disposed on a surface of said substrate (10) and a solder mask (30) coated on the surface of said substrate (10) and covered over the conductive pattern. The conductive pattern has a bonding pad (20). The solder mask (30) has an opening (31) corresponding in location to the bonding pad (20) such that a portion of the bonding pad (20) is exposed outside. A space (24) is left between said solder mask (30) and said bonding pad (20) and is communicated with the opening (31). Whereby, a solder ball (50) can be received in the opening (31) and the space (24) and electrically connected to the bonding pad (20), such that the solder ball (50) is held on the printed circuit board securely.