| 摘要 |
This invention discloses a thermoconducting silicone composition comprising the following components (A)-(F), whereof the viscosity at 25 DEG C before curing is 10-1000 Pa.s, a method of installing this composition, a heat dissipating structure of a semiconductor device using the same, and a cured material formed by heating this composition in two steps. Component (A): 100 weight parts of an organopolysiloxane having at least two alkenyl groups in the molecule, and a viscosity of 10-100,000 mm<2>/s at 25 DEG C, Component (B): An organohydrogenpolysiloxane having at least two hydrogen atoms bonded directly to silicon atoms in the molecule, in an amount such that (total number of hydrogen atoms bonded directly to silicon atoms/total number of alkenyl groups in Component (A)) is 0.5-5.0, Component (C): A low melting metal powder having a melting point of 40-250 DEG C, and an average particle size of 0.1-100 micrometers, Component (D): A highly thermoconducting filler having a melting point of more than 250 DEG C, and an average particle size of 0.1-100 micrometers, the total amount of component (C) and Component (D) being 800-2,200 weight parts, and (C)/((C)+(D)) = 0.05-0.9, Component (E): A catalytic platinum selected from a group comprising platinum and platinum compounds, 0.1-500ppm relative to Component (A) calculated in terms of platinum atom, Component (F): 0.001-5 weight parts of a controlling agent which suppresses the catalytic activity of Component (E). |
