| 摘要 |
<p>A coating of conductive material (7) is formed by a sputtering process on at least one support sheet (3) of a printed-circuit card (1), and in particular at a through hole (6) bored through one or more coupled support sheets (3). The thickness of the conductive coating (7) can be increased by electroplating. <??>Also described is a process for making printed circuit cards in which the method in reference is employed. <IMAGE></p> |
