发明名称 |
Multi-level integrated circuit for wide-gap substrate bonding |
摘要 |
An integrated circuit includes a substrate having an etched surface and a non-etched surface. The etched surface contains circuit elements and the non-etched surface contains a bonding surface. The non-etched surface is located at a predetermined height from the etched surface. Bonding this integrated circuit with another substrate creates a wide-gap between the substrates that is preferably evacuated and hermetically sealed.
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申请公布号 |
US6686642(B2) |
申请公布日期 |
2004.02.03 |
申请号 |
US20010879876 |
申请日期 |
2001.06.11 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
REGAN MICHAEL J.;LIEBESKIND JOHN;HALUZAK CHARLES C. |
分类号 |
H01L21/60;B81B7/00;B81C1/00;H01L25/00;(IPC1-7):H01L29/00;H01L21/30;H01L21/46;H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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