| 摘要 |
1,071,130. Semi-conductor devices. ROBERT BOSCH G.m.b.H. Aug. 17, 1965 [Aug. 27, 1964], No. 35120/65. Heading H1K. An encapsulated semi-conductor device such as a transistor 1, Fig. 1 (not shown), is stuck to a heat sink 5 such as a metal plate with cooling fins by a thermally conductive but electrically insulating adhesive, such as a polymeric resin. To ensure that there is no metal-to-metal contact between the capsule and the heat sink, they are spaced apart by filamentary nylon or other insulating spacer members of a thickness of about 0.1 mm. The filaments may be woven into a mesh (Fig. 1, not shown) laid down separately (Fig. 2, not shown) or formed into a spiral (Fig. 3, not shown). In all cases the adhesive bonds the metal of the capsule to that of the heat sink with the spacer filaments embedded in the adhesive. |
