| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which is improved in moisture proof by improving the adhesion between a resin sealing body and a resin stem and in luminous efficacy by improving the reflecting efficiency. SOLUTION: A semiconductor light emitting device is provided with a semiconductor light emitting element 1, a resin stem 10 which houses the other end of a first lead 21 that is led out on one end side and connected to the first electrode of the element 1 on the other end side, the other end of a second lead 22 that is led out on one end side and electrically connected to the second electrode of the element 1 on the other end side, and a bonding wire 4 that connects the second electrode of the element 1 to the other end of the second lead 22 and has a recess filled up with a light transmissive resin sealing body 5, and a projecting section 9 which covers, the entire upper surface of the stem 10 and the side faces of the upper section of the device from the upper surface of the stem, 10 to a prescribed distance from the upper surface and is made of a light transmissive thermosetting resin which functions as a lens. The projecting section 9 is formed by curing a fluid resin in a mold for molding a sealing case. Since the projecting section 9 continuously covers the upper surface and the whole side faces of the device, the adhesion between the section 9 and stem 10 becomes higher. |
