Thermal head, thermal head unit, and method of manufacture thereof

摘要

A thermal head has a head chip having an upper surface, a lower surface and a side surface. Heating elements are disposed on the upper surface of the head chip, and electrodes are disposed on the upper surface of the head chip and connected to the heating elements. A wiring substrate is disposed on the lower surface of the head chip. A semiconductor integrated circuit is mounted on the wiring substrate and is in contact with the side surface of the head chip and connected to the electrodes.