发明名称 |
Circuit board and method for manufacturing the same |
摘要 |
A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.
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申请公布号 |
US6686029(B2) |
申请公布日期 |
2004.02.03 |
申请号 |
US20030373520 |
申请日期 |
2003.02.24 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SUZUKI TAKESHI;NISHII TOSHIHIRO;TOMEKAWA SATORU;ECHIGO FUMIO |
分类号 |
H05K1/03;H05K1/11;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):B32B3/00;H01R9/09 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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