发明名称 |
Multi-chip semiconductor package with integral shield and antenna |
摘要 |
A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.
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申请公布号 |
US6686649(B1) |
申请公布日期 |
2004.02.03 |
申请号 |
US20010855244 |
申请日期 |
2001.05.14 |
申请人 |
AMKOR TECHNOLOGY, INC.;TYCO ELECTRONICS LOGISTICS AG |
发明人 |
MATHEWS DOUGLAS JAY;HILL ROBERT JOSEPH;GAYNOR MICHAEL PAUL;SCHOONEJONGEN RONALD JAMES;MIRANDA JOHN ARMANDO;SCANLAN CHRISTOPHER MARC |
分类号 |
H01L23/552;(IPC1-7):H01L23/552 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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