发明名称 Memory module using DRAM package to match channel impedance
摘要 A memory module is described. That memory module includes a memory device and a signal trace that has an unloaded portion and a loaded portion. The loaded portion has a first section and a second section. The memory device includes an input connection and an output connection. The first section of the loaded portion of the signal trace is coupled to the input connection and the second section of the loaded portion of the signal trace is coupled to the output connection. The impedance of the loaded portion is higher than it would have been if the first and second sections had been coupled to the same memory device connection.
申请公布号 US6686762(B2) 申请公布日期 2004.02.03
申请号 US20000734853 申请日期 2000.12.11
申请人 INTEL CORPORATION 发明人 LEDDIGE MICHAEL W.;MCCALL JAMES A.
分类号 G11C5/00;G11C7/10;G11C11/4093;(IPC1-7):H03K17/16;H03K19/003 主分类号 G11C5/00
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