发明名称 |
SILICONE-BASED ADHESIVE SHEET, METHOD OF BONDING A SEMICONDUCTOR CHIP TO A CHIP ATTACHMENT COMPONENT, AND A SEMICONDUCTOR DEVICE |
摘要 |
A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method. |
申请公布号 |
AU2003249594(A1) |
申请公布日期 |
2004.02.02 |
申请号 |
AU20030249594 |
申请日期 |
2003.07.14 |
申请人 |
DOW CORNING TORAY SILICONE CO., LTD. |
发明人 |
YOSHITO USHIO;TOYOHIKO FUJISAWA;KATSUTOSHI MINE;MANABU SUTOH |
分类号 |
C09J7/00;C08L83/00;C09J5/00;C09J5/06;C09J7/02;C09J183/04;C09J183/05;C09J183/07;H01L21/52;H01L21/58;H01L21/68 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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