HIGH TEMPERATURE SUBSTRATE TRANSFER ROBOT

摘要

PURPOSE: A robot for transferring a substrate in a processing system is provided to minimize thermal effects on robot positioning by using a robot component having low thermal expansion. CONSTITUTION: A robot for transferring a substrate(112) in a processing system(100) includes a body, a linkage(132) and an end effector that is adapted to retain the substrate thereon. The linkage(132) couples the end effector to the body. The end effector and the linkage are comprised of a material having a coefficient of thermal expansion less than 5x10¬-6 K¬-1. Also, the end effector and the linkage are comprised of a material having a ratio of thermal conductivity/thermal expansion greater than 1x10¬7 W/(mxK¬2).