SEMICONDUCTOR WAFER POLISHING APPARATUS AND METHOD

摘要

APPARATUS FOR POLISHING SEMICONDUCTOR WAFERS (W) COMPRISES A HOUSING (190), A MOUNTING APPARATUS WITHIN THE HOUSING (190) FOR WAX MOUNTING A FIRST FACE OF A SEMICONDUCTOR WAFER (W) TO A FIRST FACE OF A POLISHING BLOCK, AND A FIRST SEMICONDUCTOR WAFER POLISHER (58) WITHIN THE HOUSING (190) FOR POLISHING A SECOND FACE OF THE SEMICONDUCTOR WAFER (W). THE SECOND FACE OF THE SEMICONDUCTOR WAFER (W) IS OPPOSITE THE FIRST FACE OF THE SEMICONDUCTOR WAFER. A FIRST TRANSFER MECHANISM (62) IS WITHIN THE HOUSING (190) FOR DELIVERING THE POLISHING BLOCK AND SEMICONDUCTOR WAFER (W) FROM THE MOUNTING APPARATUS TO ADJACENT THE FIRST SEMICONDUCTOR WAFER POLISHER (58). A CONTROLLER (84) CONTROLS OPERATION OF THE MOUNTING APPARATUS, THE FIRST SEMICONDUCTOR WAFER POLISHER (58), AND THE FIRST TRANSFER MECHANISM (62).