发明名称 SUBSTRATE ASSEMBLING APPARATUS
摘要 PURPOSE: A substrate assembling apparatus is provided to firmly retain a substrate by a pressing plate by contracting a suction pad to locate a top end of the suction pad on a suction surface of the pressing plate. CONSTITUTION: A suction pad which is vertically expandable and contractible is disposed near the central part of the pressing plate(2). The suction pad is expanded in accordance with the amount of the deflection of a conveyed upper substrate. A negative pressure is supplied to a suction hole disposed on the pressing plate, at the same time, and the negative pressure is supplied to the suction pad, too. The substrate is sucked, thereafter, the suction pad is contracted in such a manner that the top end of the suction pad is located on the suction surface of the pressing plate. The substrate is firmly retained by the pressing plate.
申请公布号 KR20040010244(A) 申请公布日期 2004.01.31
申请号 KR20030049096 申请日期 2003.07.18
申请人 HITACHI INDUSTRIES CO., LTD. 发明人 NAKAYAMA YUKINORI;MURAYAMA TAKAO;HIRAI AKIRA;YAWATA SATOSHI
分类号 G02F1/13;G02F1/1333;G02F1/1339;G02F1/1341;G09F9/35;(IPC1-7):G02F1/13 主分类号 G02F1/13
代理机构 代理人
主权项
地址