EPOXY APPLYING APPARATUS AND EPOXY APPLYING METHOD

摘要

PURPOSE: An epoxy applying apparatus is provided to prevent a product defect occurring in a package assembling process by applying a uniform quantity of epoxy to the surface of a package. CONSTITUTION: A squeeze plate(104) with a dipping groove(105) is prepared, composed of a flat surface. An epoxy receptacle(102) is closely adhered to the squeeze plate. The side surface of the epoxy receptacle is shut, a groove is formed in the upper surface of the epoxy receptacle and the lower portion of the epoxy receptacle is open. A forward/backward cylinder axis(101) moves forward/backward the epoxy receptacle to/from the dipping groove, coupled to the epoxy receptacle. The lower portion of a dotting tool(106) is formed of a plurality of pins(107). The dotting tool transfers the epoxy of the dipping groove to a glass cover adhesion part of the package.