| 摘要 |
PURPOSE: A method for attaching an electrical connection part at a semiconductor chip package, is provided to be capable of preventing the characteristic deterioration of a semiconductor chip and reducing the size of the semiconductor chip package. CONSTITUTION: Metal paste having a lower melting point than that of an electrical connection part, is coated at an attaching pad. Then, the electrical connection part contacts the metal paste coated attaching pad. The metal paste is heated by emitting laser beam. The metal pasted is melted between the attaching pad and the electrical connection part. Preferably, the electrical connection part is a bonding wire. Preferably, the electrical connection part is a metal bump. Preferably, the attaching pad is a bonding pad. Preferably, the attaching pad is a bump pad. Preferably, the metal paste is solder paste. |
