发明名称 METHOD FOR FORMING MIM CAPACITOR
摘要 PURPOSE: A method for forming a MIM capacitor is provided to prevent an undesirable etching effect of a metal layer for bottom electrode by forming an insulating layer on the metal layer for bottom electrode and etching a dielectric layer. CONSTITUTION: The first metal layer and an insulating layer(25) are formed on a semiconductor substrate(21). A trench for exposing the first metal layer is formed by patterning the insulating layer. A dielectric layer(29) and the second metal layer are formed on a surface of the trench and the insulating layer(25). A mask pattern for limiting a capacitor forming region is formed on the second metal layer. A top electrode(31a) is formed by etching the second metal layer and the dielectric layer. The mask pattern is removed. A bottom electrode(23a) is formed by patterning the insulating layer and the first metal layer.
申请公布号 KR20040009753(A) 申请公布日期 2004.01.31
申请号 KR20020043799 申请日期 2002.07.25
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 KIM, SEOK SU
分类号 H01L27/108;H01L21/02;H01L21/20;H01L21/3213;H01L21/8242;(IPC1-7):H01L27/108 主分类号 H01L27/108
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