发明名称 |
METHOD FOR FORMING MIM CAPACITOR |
摘要 |
PURPOSE: A method for forming a MIM capacitor is provided to prevent an undesirable etching effect of a metal layer for bottom electrode by forming an insulating layer on the metal layer for bottom electrode and etching a dielectric layer. CONSTITUTION: The first metal layer and an insulating layer(25) are formed on a semiconductor substrate(21). A trench for exposing the first metal layer is formed by patterning the insulating layer. A dielectric layer(29) and the second metal layer are formed on a surface of the trench and the insulating layer(25). A mask pattern for limiting a capacitor forming region is formed on the second metal layer. A top electrode(31a) is formed by etching the second metal layer and the dielectric layer. The mask pattern is removed. A bottom electrode(23a) is formed by patterning the insulating layer and the first metal layer.
|
申请公布号 |
KR20040009753(A) |
申请公布日期 |
2004.01.31 |
申请号 |
KR20020043799 |
申请日期 |
2002.07.25 |
申请人 |
DONGBU ELECTRONICS CO., LTD. |
发明人 |
KIM, SEOK SU |
分类号 |
H01L27/108;H01L21/02;H01L21/20;H01L21/3213;H01L21/8242;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/108 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|