| 摘要 |
PURPOSE: A method for detecting defect of a wafer is provided to be capable of considerably reducing the detecting time. CONSTITUTION: A wafer(10) having a predetermined pattern is divided into a center portion(I) and an edge portion(II). A light box is designated to each cell and peripheral region of the center portion of the wafer and to each cell and peripheral region of the edge portion of the wafer. The defects of the cell region and the peripheral region are simultaneously detected by using the light boxes. Preferably, the defects of the cell region and the peripheral region are capable of being detected by using a random mode detector.
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