| 摘要 |
PROBLEM TO BE SOLVED: To use the spin-coating method in a process of applying a photosensitive resin after thin film formation in a ceramic substrate having a plurality of through-holes. SOLUTION: In this ceramic substrate having a plurality of through-holes sealed with a resin agent comprising a polyimide, a difference in height between the top surface of the resin agent sealing the through-holes and the surface of the ceramic substrate is to be 1μm or less, and the top surface roughness of the sealing agent filling the through-holes is to be 0.5μm Ra or less. COPYRIGHT: (C)2004,JPO
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