| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer for damage evaluation and a wafer damage evaluating method wherein the damage of the wafer, which is accompanied by the working of a semiconductor device which employs electrically charged particles, is evaluated at a low cost. SOLUTION: A multilayer film having photochromic effect, and a metal film connected to the multilayer film and insulated from the wafer are formed at a part on the wafer to optically evaluate a damaged part produced upon working employing the wafer. COPYRIGHT: (C)2004,JPO
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