发明名称 METHOD AND APPARATUS FOR PLASMA SURFACE TREATMENT
摘要 PROBLEM TO BE SOLVED: To provide a plasma surface treatment method and a plasma surface treatment apparatus with improved power efficiency that have the equivalent surface treatment effect as a conventional method and reduce the generation of strong X rays due to secondary electrons that are discharged from an object to be treated. SOLUTION: Plasma 12 is generated in a grounded vacuum container 11 by a plasma generating power supply 16 and a plasma generating antenna or an electrode 15. A conductive support at ground potential or the object 10 to be treated being supported by a motion/travel mechanism 19 is dipped into the plasma 12. An electrode (anode) 20 for applying a positive pulse bias is inserted into the vacuum container 11 via a vacuum feed through 17. Further, the anode 20 is connected to a pulse generator 18. When positive pulse voltages are applied from the pulse generator 18 to the object 10 to be treated, ion sheath 13 is formed between the plasma 12 and the object 10 to be treated to nearly uniformly cover the entire surface of the object 10 to be treated, and positive ions 14 in the plasma are accelerated by an electric field in the sheath to reach the surface of the object 10 to be treated. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004031461(A) 申请公布日期 2004.01.29
申请号 JP20020182259 申请日期 2002.06.21
申请人 JAPAN SCIENCE & TECHNOLOGY CORP 发明人 IKEHATA TAKASHI
分类号 C23C14/48;H01L21/265;(IPC1-7):H01L21/265 主分类号 C23C14/48
代理机构 代理人
主权项
地址