| 摘要 |
PROBLEM TO BE SOLVED: To prevent a damage related to a mechanism and a mold by preventing abnormalities in the lead frame conveyance as soon as possible in advance in a mechanism related to a lead frame conveyance of a semiconductor manufacturing device. SOLUTION: The semiconductor manufacturing device has a mechanism related to the lead frame conveyance, and comprises a sensor for detecting an overload when a sliding resistance of a lead frame has reached a prescribed value. A cutout is provided in a pin which is inserted into a prescribed hole of the lead frame and slides on the lead frame, and when the sliding resistance reaches the prescribed value, the pin is damaged by the cutout and a signal of a detector for detecting the damage is transmitted to the sensor for detecting the overload. Thus, a drive source is automatically stopped. COPYRIGHT: (C)2004,JPO
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