| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component in which a bump part connecting a chip component and a substrate is stabilized electrically and strengthwise in an electronic component mounting the chip component such as a semiconductor on a substrate in flip-chip, by forming solder bumps using copper core solder balls. <P>SOLUTION: The copper-core solder ball is loaded on an electrode of the substrate and solder bumps are formed by thermal treatment. Solder precoat is previously formed on the electrode of the loaded chip component, the chip component is flip-chip loaded on the solder bump on the substrate and thermal treatment such as reflow is performed. <P>COPYRIGHT: (C)2004,JPO</p> |
