| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck, optimum for retaining a substrate in the manufacture of a semiconductor integrated circuit and excellent in cooling performance. SOLUTION: The electrostatic chuck is provided with a first insulation layer, blended with a heat conductivity imparting agent to obtain a heat conductivity of 0.0005cal/(cm sec°C) or higher and arranged on a metallic base; a conductive pattern formed on the first insulation layer as an electrode; a second insulation layer, composed of a heat conductive silicone rubber formed on the conductive pattern and blended with the heat conductivity imparting agent to obtain the heat conductivity of 0.0005cal/(cm sec°C) or higher, a hardness of 85 or lower when the hardness is measured by a JIS A-type durometer and the surface roughness of 5μm or less, a lead wire, connected by soldering to the conductive pattern to supply a voltage to the same; and a sealing agent, laid to secure insulation between the interconnection of the lead wire to the conductive pattern and the metallic substrate. Accordingly, the electrostatic chuck becomes excellent in heat radiating property and the lose contact of the chuck to the substrate is improved. COPYRIGHT: (C)2004,JPO |
