| 摘要 |
PROBLEM TO BE SOLVED: To provide a lining processing method of a printed wiring board wherein neglect property until lamination and adhesive property of resin and a copper foil are improved without depending on resin grade, and harrowing phenomenon is not generated, and to provode a lining substrate formed by the lining processing method, and chemical coarsening liquid used for the lining processing. SOLUTION: In a manufacturing process of a multilayer printed wiring board wherein a lining substrate and prepreg laminated in an integrated body, a lining processing method of a printed wiring board is used which is provided with a process for coarsening a surface of a copper circuit formed on the lining substrate by using the chemistry coarsening liquid, and a process for treating the coarsened copper circuit surface by using silane coupling agent. COPYRIGHT: (C)2004,JPO |
